UMC stories
Intel advances chip tech with new process nodes, packaging options, and partnerships, boosting foundry services and US-based production.
Siemens Digital Industries Software has launched Calibre 3DThermal, a cutting-edge tool for thermal analysis and debugging in 3D integrated circuits, enhancing design reliability.
Intel and global semiconductor foundry, UMC, reveal partnership to create a 12-nanometer semiconductor process platform, diversifying supply chains and expanding sourcing options for clients.
Risk production of optical transceiver chips is slated for 2026 and 2027 as UMC moves silicon photonics onto 12-inch wafers.
